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EAM potential (LAMMPS cubic hermite tabulation) for the Al-Cu system developed by Liu et al. (1999) v000
https://doi.org/10.25950/2dd77629
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EAM potential for the Al-Cu system developed by Liu et al. (1999). The potential was used to study electromigration in Al-Cu interconnects.
KIM ID:
MO_020851069572_000
Extended KIM ID:
EAM_Dynamo_LiuLiuBorucki_1999_AlCu__MO_020851069572_000
Chunli Liu
Leonard Borucki
Xiang-Yang Liu
Ellad B. Tadmor
Other
OpenKIM
Registration Agency
DOI registered
December 28, 2018
via DataCite
Software published 2018 in
Open Knowledgebase of Interatomic Models (OpenKIM)
Software