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FIG S-1
https://doi.org/10.60893/figshare.jap.24899862
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FIG S-1: Laser and FIB preparation of the test devices. (a) The two devices are milled out with a laser and placed on a Cu grid. (b) Plasma FIB milling close to the localized failure positions.
P. Diehle M. Stabentheiner
M.Lejoyeux bner
DOI registered
January 10, 2024
via DataCite
Figure published 2024 in
AIP Publishing
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